Heat dissipation is an important consideration in assembling a computer. The reason is simple. When the computer is performing a high workload, it will heat up the hardware. When the components are overheated, it will cause performance problems. How to let all components fully dissipate heat so that the system can perform optimally? It has become an important consideration in the design of a computer host, especially CPU heat dissipation is the key.
Yuande Electronic Technology Co., Ltd. launched the ENCTEC REV.B250 motherboard, subverting the tradition by installing the CPU on the back of the motherboard. The main function is to get rid of the heat accumulation dilemma. In simple terms, the reverse installation of the CPU means that the CPU of the motherboard that has been used for many years is arranged on the front side (the side with PCI-E, memory slot), and is now reversely installed on the back of the motherboard. Since then, the market has been divided into two types of motherboards to provide customers with choices.
The design of ENCTEC REV.B250 motherboard CPU reverse installation can break through the traditional motherboard CPU heat source trapped in the case, the heat source can be released from the back of the case, and the entire universe is available for heat dissipation. The following advantages are that the chassis can be reduced, can be sealed and dustproof, can be modularized and superimposed, can be modularized for heat dissipation, CPU and GPU heat dissipation will not affect each other, vertical installation is not afraid of water cooling head leakage, easy installation, simple wiring . And if full passive cooling is used, the CPU will run 100% for a long time without frequency reduction, the noise value is less than 22db, energy saving and carbon reduction, and will not crash due to fan damage (equipped with CPU cooling fins, fanless power supplies, and SSD hard disks. ).
The ENCTEC REV.B250 motherboard launched by Yuande Company uses the B250 chip intel-i7 series CPU, but the motherboard has a high CP value. After repeated tests, it can support 95% of the market's video games smoothly, not to mention the processing of papers.
Yuande said that the current motherboards on the market are much the same. Brands only compete in materials and production yields. Second-tier brands want to surpass. Unless there are innovative designs and selling points, chances are small. The CPU reverse-installed motherboard is an innovative product that breaks through the tradition and has obtained a patent certificate.
In order to assist in the development of the industry, Yide is willing to release some of the patent licenses to assist manufacturers who intend to enhance their brand competitiveness to overtake fast corners. The estimated success rate can be greatly improved. This is a rare opportunity. Welcome to inquire.