There are many ways to dissipate the CPU, the most common ones are air cooling, open water cooling, and integrated water cooling. When the processor itself is the main source of heat energy in the computer case, plus the heat generated by its surrounding components, all accumulate in the small space of the case, if the heat dissipation is not done properly, it will not only cause the computer Performance degradation may also cause hardware damage. At the same time, the graphics cards and radiators are now getting larger and larger, competing with each other for the limited space in the chassis. It can be imagined that the future CPU will be faster, which also means that better heat dissipation efficiency is required.

But what if our heat dissipation space can not be limited to a small chassis space? From this perspective, Yuande Electronics uses its own technology patents to launch the "ENCTEC REV.SERIES" motherboard that moves the processor and chipset to the back of the motherboard. The layout design is commonly used in industrial computers, and it is trying to consume In the sex market, it brings another kind of applied thinking to solve the problem.

Compared with the current mainstream general consumer motherboards, the most obvious advantage of moving the processor and chipset to the back of the motherboard is to make the space on the front of the motherboard more open. In this way, not only can the accumulation on the front of the motherboard be reduced In addition to heat, it can also improve the smoothness of the airflow direction of the air intake and exhaust of the cabinet fan, so as to achieve the purpose of greatly reducing the temperature in the cabinet space.

Due to the characteristics of the ENCTEC REV.SERIES motherboard layout design, Yuande Electronics also has a barebones chassis and heat sink that can be installed and applied.
The barebones case for industrial computers, in addition to the dust-proof closed case design, has a flat appearance, and has a high degree of scalability in a limited application environment. In addition, in addition to its own installation, The heat dissipation module is very easy to replace, so that the barebones chassis and the environment can achieve the heat dissipation effect.

In addition, the processor of the ENCTEC REV.SERIES motherboard can be said to be exposed under the outer space of the case. The size of the radiator matched with it can finally be free from the limitation of the inner space of the case, and there is no need to worry about installing the radiator. , Will it interfere with the operation of the surrounding components? Therefore, the size of the heat sinks launched by Yuande Electronics is quite large. It is hoped that the heat dissipation area and environmental space can be achieved by expanding the heat dissipation area and the environment under the passive heat dissipation method that does not consume power and noise. Certain heat dissipation efficiency.

Although moving the processor and chipset to the motherboard on the back of the motherboard has long been widely used in industrial computer applications, the unique insight of Yuande Electronics from the generation of processors can bring higher computing performance. However, it also indicated that there is a trend that more waste heat needs to be dissipated and dissipated. Seeing that there is still room for improvement and application in the current consumer market computer cooling design.

Therefore, the ENCTEC REV.SERIES motherboard launched by Yuande Electronics with its own patented layout design technology, with its layout design similar to the motherboard, has been used for many years in industrial computer applications with extremely strict heat dissipation requirements. Application performance, in the consumer market, hope to provide another heat dissipation solution that is different from the current product design to meet the high-end players’ requirements for computer heat dissipation. For the makers who are tired of the appearance of the computer The position of the processor is different from the current motherboard design, I believe it can also stimulate the starter to modify the computer case creatively.

The ENCTEC REV. Q270 we have on hand currently only supports Intel's seventh-generation CPU, but it is understood that a motherboard supporting Intel's 10th-generation Z490 is currently under development. It is assumed that it will be available next year Q1. If you are interested in the board, you can follow Yuande’s official website or Facebook fan group to get news about their latest products.