[Registration time] From now until 2020/12/13 (Sun) 23:59
[Registration Qualifications] You can register if the following characteristics
-T kebang members, bloggers
-netizens who like cabinet modification, netizens who insist on cooling the host-netizens
who want to experience the latest technology
[Registration method] Register now and fill in the form!
[Activity Quota] A total of 10 people exceed the quota
[Announcement of the selected list] Before 2020/12/16 (Wednesday)
[Experience product] Yide Electronics Q270 motherboard
Netizens selected for the experience will provide "Yide Electronics Q270 motherboard", "Thermaltake Core P5 chassis", "ENCTEC special giant heat pipe heat sink" and "Intel i7-7700 CPU" for you to directly use to modify the machine.
[Article submission time] 2021/1/17 (Sun) before 23:59
[How to submit your tips] Please email your tips in Word or PDF format to firstname.lastname@example.org within the specified time.
Precautions for publishing experience experience:
[Threshold for sharing experience]
Participating netizens must complete the writing of good articles. If you can shoot a movie, it will be more important!
The article must have both pictures and texts, and the content must have at least 10 pictures + 1,000 texts + sharing on more than 2 social media platforms. The
video must be out of the box for more than 3 minutes
★ Graphical descriptions of the actual products used
★ Graphic introduction to the installation process
★ The heat dissipation characteristics of the Q270 motherboard (refer to the following 4 points)
1) Demonstrate the reverse installation of the CPU (reminder: the case of the sample product can be directly mounted without modifying the parts)
2) Try to modify the chassis (use other commercially available chassis or design a bare test frame to install the motherboard and heat sink)
3) The anti-heat performance of various heat dissipation formulas after modification (such as time-lapse movies and screenshots of the actual burn-in test)
4) Share the difference in the cooling plan between the front and the reverse of the CPU