In response to many testing needs, EDAC Electronics has launched the industry's first testing instrument specifically for bright surface materials-Reflect Control (hereinafter referred to as RC). Its characteristic is that the stronger the reflective surface, the higher the accuracy. It solves the difficulty of mirror material detection in one fell swoop issue. At the same time, RC's Z-axis accuracy can reach 10nm level, and its detection principle is protected by exclusive patents. It is equipped with high-intensity computing technology under high-precision conditions, and the detection time will be greatly reduced.
The principle of RC imaging is derived from the three-dimensional topography produced by fringe projection. The reflection of fringe light collects subtle changes on the measured surface, and then generates a point cloud and 3D graphics through the back-end processing computing technology. This actuation principle puts aside the traditional contact-type three-dimensional measurement concept. It can be analyzed without actually touching the test object. At the same time, it maintains a certain degree of precision and is more suitable for those fragile and fragile products (glass, wafer, etc.) .
In addition to precision vision instruments, EDAC is also proficient in the design of high-speed automation machines to cope with a large number of full inspection occasions. Now I design an IQC rapid testing machine for the popular Type-C connector. The testing speed can be 0.2 to 0.5 seconds, and it takes up to 1.5 hours to detect 10,000. It can be increased by only purchasing one in the factory. With a purchase yield rate of over 95%, the quality of products purchased in batches can be effectively controlled, and the production suppliers can be quantified and screened. This will lead to yield competition among suppliers and begin to focus on production quality. Assemblers spend a small amount of money but get high-quality products (the unit price of products will not rise as a result, because suppliers have competitive order pressures), thereby increasing the yield of assembled products. .